Semiconductor device having dual isolation structure and method of fabricating the same

ABSTRACT

In a semiconductor device having a dual isolation structure, and a method of fabricating the same, an epitaxial layer is formed on the entire surface of the semiconductor device. A device region including the semiconductor device and the epitaxial layer is defined by a device isolation layer. The device isolation layer has a dual structure that includes a diffused isolation layer and a trench isolation layer. The diffused isolation layer is formed in the semiconductor substrate, and surrounds the base and the bottom sidewall of the device region, and the trench isolation layer surrounds the upper sidewall of the device region by vertically penetrating the epitaxial layer. The method of fabricating a semiconductor device is performed by forming a diffused bottom isolation layer at a predetermined region in the semiconductor substrate, and forming a trench exposed at a predetermined region of the semiconductor substrate by patterning the epitaxial layer formed on the entire surface of the semiconductor substrate. A diffused isolation wall is formed to be connected to the diffused bottom isolation layer under the trench. A trench isolation structure is formed to be connected to the diffused isolation wall by filling an insulating layer inside the trench.

RELATED APPLICATIONS

This application is a divisional of U.S. application Ser. No.10/379,243, filed on Mar. 4, 2003, which relies for priority upon KoreanPatent Application No. 02-11623, filed on Mar. 5, 2002, the contents ofwhich are herein incorporated by reference in their entirety.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a semiconductor device and a method offabricating the same, and more particularly, to a semiconductor devicehaving a dual isolation structure and a method of fabricating the same.

2. Discussion of the Related Art

In the semiconductor arts, there continues to be an ever-increasingdemand for a high level of power transmission, for high speed switchingability during power conversion, and for various applications of powerIC products in power control systems. Power IC products are widely usedin automotive electronic componentry as well as in hard disk drive (HDD)and in video tape recording (VTR) systems. Double-diffused MOStransistors (DMOS Tr) offer the combination of high-current processingability and low on-resistance per surface area; therefore DMOStransistors are an important element of the power IC in the processingof high voltages.

Since the DMOS device is operated at high voltage, a device isolationlayer having a high breakdown voltage is required between adjacent DMOSdevices or between the DMOS device and other control circuits.Conventionally, junction isolation technology using an impurity-diffusedlayer for device isolation was employed for this purpose. However, inthe case of junction isolation technology, the junction isolationstructure requires a wide surface area in order to form deep deviceisolation structures, as the structure of the DMOS device requires thickepitaxial layers. In order to overcome this limitation, there has beenintroduced a method of forming a trench device isolation structure. U.S.Pat. No. 5,356,822, entitled “Method for making all complementaryBICDMOS devices” introduces a method of isolating devices by forming aDMOS device on a silicon on insulator (SOI) substrate.

FIG. 1 is a sectional view of a conventional DMOS device having a deviceisolation structure employing the junction isolation technology.

Referring to FIG. 1, a DMOS device of the junction isolation structureincludes a semiconductor substrate 1, a first conductivity type buriedlayer 6 placed on a predetermined region of the semiconductor substrate1, and a second conductivity type buried layer 2 slightly spaced apartfrom the first conductivity type buried layer 6 and surrounding theburied layer 6. A first conductivity type epitaxial layer 8 is depositedon the entire surface of the first conductivity type layer 6, the secondconductivity type layer 2, and the semiconductor substrate 1. Theepitaxial layer 8 is more lightly doped than the first conductivity typeburied layer 6. A second conductivity type junction isolation layer 4 isconnected to the second conductivity type buried layer 2 whilesurrounding a predetermined region of the epitaxial layer 8. Thejunction isolation layer 4 and the second conductivity type buried layer2 form a device isolation structure 5 of the DMOS device. The deviceisolation structure 5 defines the device region of the DMOS device. Afield oxide layer 16 is placed in a predetermined region of the deviceregion surrounded by the device isolation structure 5 to define a firstactive area and a second active area. The field oxide layer 16 surroundsthe first active area spaced apart from the device isolation structure5. A gate electrode 14 is placed on the first active area with a gateinsulating layer 22 interposed there between. A source region is formedin the first active area adjacent to the gate electrode 14, and a drainregion is formed in the second active area. The source region 26includes a first conductivity type diffused layer 18 formed on thesurface of the first active area adjacent to the gate electrode 14, asecond conductivity type diffused layer 20 spaced apart from the gateelectrode 14 adjacent to the first conductivity type diffused layer 18,and a second conductivity type body region 26 surrounding the firstconductivity type diffused layer 18 and the second conductivity typediffused layer 20. The drain region includes a sink region 10 verticallypenetrating the epitaxial layer 8 and connected to the firstconductivity type buried layer 6, and a heavy doped region 12 formed onthe surface of the second active area on the sink region 10. A fieldoxide layer 15 is further formed on the junction isolation layer 4 fordevice isolation.

Normally, the breakdown voltage of the DMOS device is proportional tothe thickness of the epitaxial layer 8. That is, the epitaxial layer 8is typically formed to have a thickness of over 10 μm, in order toprovide a high breakdown voltage in the DMOS device. Therefore, whenforming the second conductivity type junction isolation layer 4 throughthe thick epitaxial layer 8, and considering the diffusion of theimpurity to form the second conductivity type junction isolation layer4, the junction isolation layer and the drain region should bepositioned a suitable distance apart. As a result, the area sizeoccupied by the device isolation structure in the DMOS device employingthe junction isolation technology is over 25% of the entire deviceregion.

FIG. 2 is a sectional view of a DMOS device having a trench deviceisolation structure that was introduced in order to overcome theabove-mentioned limitations in the traditional junction isolationstructures.

Referring to FIG. 2, as in the junction isolation structures describedabove, a DMOS device having a trench device isolation structure includesa first conductivity type buried layer 36 formed on a semiconductorsubstrate 31, an epitaxial layer 38 covering the buried layer 36 and thesemiconductor substrate 31, a gate electrode 34 formed on the epitaxiallayer 38, a source region and a drain region. The source region and thedrain region have the same structure as the corresponding parts of theDMOS device having the junction isolation structure. That is, the sourceregion includes a first conductivity type diffused layer 48, a secondconductivity type diffused layer 30, and a second body region 44. Thedrain region includes a sink region 40 connected to the buried layer 36,and a heavy doped region 42 formed on the upper side of the sink region40. A device isolation structure 32 is placed to penetrate a portion ofthe epitaxial layer 38 and the semiconductor substrate 31. The deviceisolation structure 32 defines the device region. A field oxide layer 46is placed on a predetermined region of the device region surrounded bythe device isolation structure 32 to thereby define the first activearea and the second active area. The gate electrode 34 and the sourceregion are placed on the first active area surrounded by the field oxidelayer 46. The drain region is placed in the second active area betweenthe field oxide layer 46 and the device isolation structure 32.

As described above, the device isolation structure 32 is more deeplyformed than the first conductivity type buried layer, in order toisolate between neighboring DMOS devices and between the DMOS devicesand other control circuits. That is, the device isolation structure 32has a thickness over about 20 μm in the DMOS device having a workingvoltage of about 70 V. However, there is a limit in forming the deeptrench device isolation structure in such a small area because ofdifficulties in the etching and burying processes.

SUMMARY OF THE INVENTION

Accordingly, the present invention is directed to a semiconductor deviceand a method of fabricating semiconductor devices that substantiallyobviate one or more of the limitations and disadvantages of the relatedart.

A feature of the present invention is to provide a semiconductor deviceand a method of fabricating the same having a much-improved isolationstructure that provides for enhanced device isolation ability.

Another feature of the present invention is to provide a semiconductordevice and a method of fabricating the same having a device isolationstructure in which the area required for device isolation is relativelysmall as compared to the area occupied by the device region.

In accordance with the purpose of the invention, as embodied anddescribed herein, a semiconductor device having a dual isolationstructure is provided in accordance with the present invention. Thedevice includes a semiconductor substrate and a first conductivity typeepitaxial layer on the surface of the semiconductor substrate.

The device region including the semiconductor substrate and theepitaxial layer is defined by the device isolation structure. Adouble-diffused MOS transistor (DMOS Tr.) is placed in the deviceregion. The device isolation structure has a dual structure including adiffused isolation layer and a trench isolation layer. The diffusedisolation layer is formed in the semiconductor substrate, and surroundsthe base and the bottom sidewall of the device region, and the trenchisolation layer vertically penetrates the epitaxial layer and surroundsthe upper sidewall of the device region. Inside the device region, theremay be formed a high frequency bipolar transistor or high voltagecontrol circuit, etc.

According to one embodiment of the present invention, a first conductiveburied layer may be interposed at a predetermined region between thesemiconductor substrate and the epitaxial layer of the device region,and on the epitaxial layer of the device region may be placed a fieldoxide layer to define a first active area and a second active area. Inaddition, a gate electrode is placed on the first active area, and asource region and a drain region may be placed inside the first activearea and the second active area respectively. A vertical double diffusedMOS transistor includes the gate electrode, the source region, the drainregion, the buried layer, and the epitaxial layer between the buriedlayer and the source region. The source region includes a secondconductive body region and a heavy doped first conductive diffused layerformed on the body region.

In another aspect of the present invention, there is provided a methodof fabricating a semiconductor device having a double isolationstructure. The method includes the steps of forming a diffused bottomisolation layer by implanting a second conductive impurity into apredetermined region of a semiconductor substrate, and forming a firstconductive epitaxial layer on the semiconductor substrate. The epitaxiallayer is patterned to form a trench exposed at a predetermined region ofthe semiconductor substrate, and a diffused isolation wall is formedwhich is connected with the diffused bottom isolation layer by injectinga second conductive impurity into the lower side of the trench. Thediffused bottom isolation layer and the diffused isolation wall form thediffused isolation layer. A trench isolation structure is formed whichis in contact with the diffused isolation wall by filling an insulatinglayer inside the trench. The trench isolation structure and the diffusedisolation layer form the device isolation structure to define a deviceregion which is formed by the sequentially deposited semiconductorsubstrate and epitaxial layer.

In another aspect of the present invention, a method of fabricating asemiconductor device further may include the steps of forming a firstconductivity type buried layer by implanting a first conductivity typeimpurity into the surface of the semiconductor substrate on the diffusedbottom isolation layer after forming the diffused bottom isolationlayer. In addition, a field oxide layer to define the first active areaand the second active area may be formed on the upper side of theepitaxial layer of the device region after defining the device region. Agate electrode and a source region are formed on the first active area,and a drain region is formed in the second active area. As a result, avertical double diffused MOS transistor is formed in the device region.

It is to be understood that both the foregoing general description andthe following detailed description of the present invention areexemplary and explanatory and are intended to provide furtherexplanation of the invention as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The foregoing and other objects, features and advantages of theinvention will be apparent from the more particular description ofpreferred embodiments of the invention, as illustrated in theaccompanying drawings in which like reference characters refer to thesame parts throughout the different views. The drawings are notnecessarily to scale, emphasis instead being placed upon illustratingthe principles of the invention.

FIG. 1 is a sectional view of a conventional DMOS device having a deviceisolation structure manufactured by employing a junction isolationtechnology;

FIG. 2 is a sectional view of a DMOS device having a trench deviceisolation structure introduced to overcome the problems of the junctionisolation technology;

FIG. 3 is a schematic sectional view of a portion of a power IC havingthe DMOS device according to a preferred embodiment of the presentinvention;

FIG. 4 is a plane view of the DMOS device according to a preferredembodiment of the present invention; and

FIGS. 5 to 13 are sectional views of the fabricating process of the DMOSdevice according to a preferred embodiment of the present invention.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

Reference will now be made in detail to the preferred embodiments of thepresent invention, examples of which are illustrated in the accompanyingdrawings. However, the present invention is not limited to theembodiments illustrated hereinafter. Instead, the embodiments describedherein are introduced in order to provide a complete understanding ofthe scope and spirit of the present invention. The thickness of thelayers and regions in the drawings is exaggerated in order to clearlyshow the device structure. In references to a particular layer beingformed on another layer or on a substrate, that layer can be directlyformed on another layer or on a substrate, or a third layer may beinterposed therebetween. Wherever possible, the same reference numberswill be used throughout the drawings to refer to the same or like parts.

FIG. 3 is a schematic representation of a portion of the power IC havinga DMOS device according to one embodiment of the present invention.

FIG. 4 is a plane view of the DMOS device according to one embodiment ofthe present invention.

Referring to FIGS. 3 and 4, the power IC includes various devices thatoperate at high frequency and high voltages. As shown in the drawings,the power IC includes a MOS transistor (MOS Tr.), a bipolar transistor(Bipolar Tr.), a double diffused MOS transistor (DMOS Tr.), etc.Recently, the power IC primarily employs a vertical double diffused MOS(VDMOS) device having excellent performance characteristics in arelatively small chip area. Each device is isolated from neighboringdevices by a device isolation structure having a high breakdown voltage.

The DMOS device of the present invention includes a first conductivitytype buried layer 54 formed on a predetermined region of a semiconductorsubstrate 50. A first conductivity type epitaxial layer 56 is formedover the buried layer 54 and the entire surface of a semiconductorsubstrate 50. The buried layer 54 is formed of an impurity diffusedlayer wherein phosphorus (P), arsenic (As), antimony (Sb) are diffusedinto the semiconductor substrate 50 with a predetermined thickness. Inaddition, the buried layer 54 is formed to be diffused into theepitaxial layer 56 with predetermined thickness. The epitaxial layer 56also has an n-type conductivity type impurity including phosphorus (P),arsenic (As), antimony (Sb). The epitaxial layer 56 is more lightlydoped than the buried layer 54. A device isolation structure 90 isplaced to penetrate the epitaxial layer 56 and a portion of thesemiconductor substrate to define the device region of the DMOS device.The device isolation structure 90 includes a diffused isolation layer 63formed at the semiconductor substrate 50 and surrounding the lower sideof the device region, and a trench isolation structure 64 formed at theepitaxial layer 56 and surrounding the upper sidewall of the deviceregion. The diffused isolation layer 63 is formed to be an impuritydiffused layer having a second conductivity type impurity that isdiffused into the semiconductor substrate 50. For example, the diffusedisolation layer 63 is formed to be an impurity diffused layer includingboron (B), boronfluoric (BF₂), indium (In). The diffused isolation layer63 includes a diffused bottom isolation layer 52, and a diffusedisolation wall 62. The diffused bottom isolation layer 52 is formedalong the base of the device region, and the diffused isolation wall 62surrounds the bottom sidewall of the device region and is connected tothe diffused bottom isolation layer 52. That is, the diffused isolationlayer 63 operates to isolate the semiconductor substrate region of thedevice region from the surrounding semiconductor substrate. The diffusedbottom isolation layer 52 may extend horizontally down to a neighboringDMOS device or to the bottom of a device region on which a high voltagecontrol circuit will be formed.

A field oxide layer 66 is placed on a predetermined region of the deviceregion defined by the device isolation structure 90 to define a firstactive area a1 and a second active area a2. The first active area a1 isthe region surrounded by the field oxide layer 66, and the second activearea a2 is the region between the field oxide layer 66 and the deviceisolation structure 90. The field oxide layer 66 is formed by usingLOCOS technology.

A gate electrode 74 is placed on the first active area a1. A gateinsulating layer 72 is interposed between the gate electrode 74 and thefirst active area a1. The gate electrode 74 has an overlapped regionwith the field oxide layer 66.

As shown in FIG. 4, the gate electrode 74 may have a mesh-shapedstructure in a typical DMOS device. That is, the gate electrode 74 has aplurality of openings to expose the first active area a1. A sourceregion is formed in the first active area a1 exposed on the opening, anda drain region is formed in the second active area a2. The source regionincludes the first conductivity type diffused layer 78 and the secondconductivity type body region 76. The first conductivity type diffusedlayer 78 is formed in the first active area a1 adjacent to the gateelectrode 74. The second conductivity type body region 76 is more deeplydiffused than the first conductivity type diffused layer 78, surroundingthe first conductivity type diffused layer 78, and has an overlappedregion with the gate electrode 74. That is, the first conductivity typediffused layer 78 is formed on the surface of the second conductivitytype body region 76. The source region may further include the secondconductivity type diffused layer 80 on the surface of the secondconductivity type body region 76 to prevent the parasitic bipolartransistor from turning on in the DMOS device. For example, the firstconductivity type diffused layer 78 is formed on the peripheral regionof the first active area a1 exposed on the opening to have a loopstructure, and the second conductivity type diffused layer 80 is formedin the region surrounded by the loop structure. The second conductivitytype diffused layer 80 is more heavily doped than the body region 76.

The field oxide layer 66 is formed on the device region spaced apartfrom the device isolation structure 90. The field oxide layer 66 isloop-shaped and defines the first active area a1 in the regionsurrounded by the field oxide layer 66, and defines the second activearea a2 between the field oxide layer 66 and the device isolationstructure 90. The drain region is formed in the second active area a2,and includes a first conductivity type sink region 70 which is formed inthe second active area a2 and vertically connected with the buried layer54, and a heavily doped region 82 formed on the surface of the secondactive area a2 having the sink region 70 formed thereon. The drainregion and the source region are connected to a drain electrode (DC) anda source electrode (SC) respectively. Since the source electrode (SC) iscommonly connected to the first conductivity type diffused layer 78 andthe second conductivity type diffused layer 80, the parasitic bipolartransistor is restricted to turn on while the DMOS is operated.

As described above, the device isolation structure of the presentinvention has a dual structure of a trench device isolation structureformed on the diffused isolation layer and the epitaxial layer on thesemiconductor substrate. For this reason, formation of the trench deviceisolation structure of the present invention is relatively simple, andthe area occupied by the device isolation structure can be reduced ascompared with the junction isolation structure.

FIGS. 5 to 13 are sectional views that illustrate a process offabricating a DMOS device according to one preferred embodiment of thepresent invention.

Referring to FIGS. 5 and 6, a second conductivity type impurity isimplanted into a predetermined region of the semiconductor substrate 50to form the diffused bottom isolation layer 52. The diffused bottomisolation layer 52 can be formed by implanting a p-type impurity such asboron (B), boronfluoric (BF₂), indium (In) into the semiconductorsubstrate 50. For example, the boron may be implanted into thesemiconductor substrate 50 with a flux density of 1×10¹⁴/cm² to1×10¹⁵/cm². Then, a first conductivity type impurity is implanted to thesurface of the semiconductor substrate on the diffused bottom isolationlayer 52 to form a first conductivity type buried layer 54. The buriedlayer 54 can be formed by implanting an n-type impurity such asphosphorus (P), arsenic (As), antimony (Sb) into a predetermined regionof the upper side of the diffused bottom isolation layer 52 with a highflux density.

Referring to FIG. 7, a first conductivity type epitaxial layer 56 isgrown on the buried layer 54 and the entire surface of the semiconductorsubstrate 50. The epitaxial layer 56 can be formed with a thickness ofabout 10 μm. While the epitaxial layer 56 is grown, the firstconductivity type buried layer 54 is externally diffused down to theepitaxial layer 56 and the semiconductor substrate 50. Accordingly, theburied layer 54 may have a thickness of about 3 μm to 10 μm. Adding tothis, the buried layer 54 can be diffused by using a thermal process onthe substrate before or after forming the epitaxial layer 56. Theepitaxial layer 56 is preferably doped with a lower density than theburied layer 54.

Referring to FIGS. 8 and 9, a hard mask pattern 58 is formed on theepitaxial layer 56, and the epitaxial layer 56 is etched by using thehard mask pattern 58 as an etch mask so as to form a trench 60 to exposea predetermined region of the semiconductor substrate 50. The trench 60is formed as a loop shape surrounding a predetermined region of theepitaxial layer 56. Then, a second conductivity type impurity isimplanted into the semiconductor substrate 50 which is exposed at thebottom of the trench 60 by using the hard mask pattern 58 as an ionimplantation mask. As a result, a diffused isolation wall 62 is formedin the semiconductor substrate 50. The diffused isolation wall 62 isconnected to the diffused bottom isolation layer 52 so as to form adiffused isolation layer 63 to isolate a predetermined region of thesemiconductor substrate 50 from its surrounding semiconductor substrate.That is, the diffused isolation layer 63 surrounds the sidewall and thebase of a predetermined region of the semiconductor substrate 50. Thehard mask pattern 58 is preferably formed of a silicon nitride layer. Abuffer oxide layer may be further formed between the hard mask pattern58 and the epitaxial layer 56.

Referring to FIG. 10, an insulating layer is formed on the upper side ofthe epitaxial layer to fill the trench, and a trench isolation structure64 is formed inside the trench by grinding the insulating layer by achemical and mechanical grinding process. Then, the hard mask pattern 58is removed to expose the epitaxial layer 56. The trench isolationstructure is formed by using a typical shallow trench isolationtechnology. The insulating layer selected to fill the inside of thetrench is preferably one that has excellent step coverage, and forexample, PEOX (plasma enhanced oxide), or HDP oxide layer (high densityplasma oxide) can be used. The device isolation structure 90 includesthe diffused isolation layer 63 and the trench isolation structure 64.The region surrounded by the device isolation structure 90 is a deviceregion.

Referring to FIG. 11, a field oxide layer 66 is formed on the epitaxiallayer 56 of the device region so as to define the first active area a1and the second active area a2. The field oxide layer 66 is formed as aloop shape spaced apart from the device isolation structure 90. Theregion surrounded by the field oxide layer 66 is the first active areaa1, and the region between the field oxide layer 66 and the deviceisolation structure 90 is the second active area a2. The field oxidelayer can be formed by using a typical LOCOS process. A firstconductivity type impurity is implanted into the second active area a2so as to form a sink region 70 connected to the buried layer 54. Thesink region 70 may be formed after or before forming the field oxidelayer 66. In case of forming the sink region 70 before forming the fieldoxide layer 66, a thermal oxidation process to form the field oxidelayer 66 may be performed, and during the process, the resistance of thesink region 70 can be reduced. However, in case of forming the sinkregion 70 after forming the field oxide layer 66, the thermal process ispreferably performed on the substrate having the sink region afterforming the sink region 70 to reduce the resistance of the sink region70.

The sink region 70 can be formed by implanting an n-type impurity intothe epitaxial layer 56. That is, phosphorus (P), arsenic (As), antimony(Sb) can be implanted into the epitaxial layer 56 so as to form the sinkregion 70. It is preferable to dope the sink region 70 with a higherdensity than the epitaxial layer. For example, the implantation can beperformed with 100 KeV to 500 KeV of energy and 1×10¹⁴/cm² to 5×10¹⁵/cm²of flux density into the epitaxial layer 56 to form the sink region 70.

Referring to FIG. 12, a gate pattern 74 is formed on the first activearea. The gate pattern 74 may have an overlapped region with the upperside of the field oxide layer 66. In addition, the gate pattern 74 maybe formed, as shown in FIG. 4, as a mesh-shaped structure having aplurality of openings exposed at predetermined regions of the firstactive area a1. Accordingly, the DMOS device has a plurality of sourcecells so as to increase the power drive characteristic. A gateinsulating layer 72 is interposed between the gate electrode 74 and thefirst active area a1. Sequentially, a second conductivity type impurityis implanted into the first active area a1 by using the photoresistpattern (not shown) to expose the first active area a1, and the gateelectrode 74 as an ion implantation mask. Then, a thermal process isperformed on the substrate on which the impurity is implanted so as toform a second conductivity type body region 76 in the first active areaa1 exposed at the opening. The body region 76 is diffused down to thegate electrode 74 and has an overlapped region with the lower side ofthe gate electrode 74. The body region 76 may be formed by implanting ap-type impurity such as boron (B), boronfluoric (BF₂), indium (In), etc.

Referring to FIG. 13, a first conductivity type impurity is implantedinto the surface of the first active area a1 and the second active areaa2 exposed inside the opening formed on the gate pattern 74. As aresult, the first conductivity type diffused layer 78 is formed on thesurface of the first active area a1, and the heavily doped firstconductivity type region 82 is formed on the surface of the secondactive area a2. The first conductivity type diffused layer may be formedas a loop shape on the peripheral region of the opening adjacent to thegate electrode by using the photoresist pattern (not shown). The firstconductivity type diffused layer 78 and the heavy doped region 82 can beformed by implanting an n-type impurity such as phosphorus (P), arsenic(As), antimony (Sb). At this point, it is preferable to dope the firstconductivity type diffused layer 78 and the heavily doped diffused layer82 with a higher density than the epitaxial layer 56. In addition, theheavily doped diffused layer 82 is preferably doped with a higherdensity than the sink area 70.

A heavily doped second conductivity type diffused layer 80 is preferablyformed on the surface of the body region 76 to prevent the turning-on ofthe parasitic bipolar transistor during the operation of the DMOS deviceso as to connect the first conductivity type diffused layer 78 and thesecond conductivity type diffused layer 80 with a common electrode. Forexample, in case of forming the first conductivity type diffused layer78 as a loop shape, a second conductivity type impurity is implanted onthe region surrounded by the first conductivity type diffused layer 78so as to form the second conductivity type diffused layer 80. The secondconductivity type diffused layer can be formed by implanting a p-typeimpurity such as boron (B), boronfluoric (BF₂), indium (In). At thispoint, preferably, the second conductivity type diffused layer 80 isdoped with a higher density than the second conductivity type bodyregion 76. The first conductivity type diffused layer 78 and the secondconductivity type diffused layer 80 can be formed on the surface of thebody region 76 with various shapes.

The first conductivity type diffused layer 78, the second conductivitytype diffused layer 80, and the second conductivity type body region 76form the source region of the DMOS transistor. In addition, the sinkregion 70 and the heavily doped first conductivity type region 82 formthe drain region of the DMOS transistor.

Even though further drawings are not shown here, by using a typicalmethod of fabricating a semiconductor device, the gate electrode, andthe source electrode and the drain electrode which are connected to thesource region and the drain region respectively can be formed. At thispoint, the source electrode can be commonly connected to the firstconductivity type diffused layer and the second conductivity typediffused layer. As set forth before, the present invention provides adevice isolation structure for a semiconductor device having excellentdevice isolation characteristics and reduced area size, by providing adual device isolation structure. In this manner, the present inventionaddresses the limitations associated with the conventional semiconductordevice having a junction device isolation structure, which requires arelatively large amount of area for the device isolation region due tothe external diffusion. The present invention further provides asemiconductor device having a deep device isolation structure by solvingthe difficulties in the conventional device isolation structure informing a trench isolation structure at a depth of over 15 μm. As aresult, the device isolation ability of the semiconductor deviceoperated at high frequency and high voltage can be greatly improved,while reducing the area occupied by the isolation structure.

While this invention has been particularly shown and described withreferences to preferred embodiments thereof, it will be understood bythose skilled in the art that various changes in form and details may bemade herein without departing from the spirit and scope of the inventionas defined by the appended claims.

1. A method of fabricating a semiconductor device comprising the stepsof: implanting a second conductivity type impurity into a predeterminedregion of a semiconductor substrate to form a diffused bottom isolationlayer; forming a second conductivity type epitaxial layer on thesemiconductor substrate; patterning the epitaxial layer to form a trenchexposing a predetermined region of the semiconductor substrate;implanting the second conductivity type impurity into the lower portionof the trench to form a diffused isolation wall in the semiconductorsubstrate that is connected to the diffused bottom isolation layer; andfilling an insulating layer in the trench to form a trench isolationstructure in contact with the diffused isolation wall, wherein thetrench isolation structure, the diffused isolation wall and the diffusedbottom isolation layer define a device region including thesemiconductor substrate and the epitaxial layer.
 2. The method of claim1, further comprises the step of implanting a first conductivity typeimpurity onto the surface of the semiconductor substrate on the upperside of the diffused bottom isolation layer to form a first conductivitytype buried layer prior to forming the epitaxial layer, wherein theburied layer is spaced apart from the diffused bottom isolation layerand the diffused isolation wall.
 3. The method of claim 1, after thestep of forming the trench isolation structure, further comprising thesteps of: forming a field oxide layer on the device region to divide thefirst active area and the second active area; forming a gate electrodeon the first active area; forming a source region in the first activearea beside the gate electrode; and forming a drain region in the secondactive area with connected to the buried layer
 4. The method of claim 1,wherein the step of forming the trench, the diffused isolation wall, andthe trench isolation structure comprises the steps of: forming a hardmask pattern on the epitaxial layer; forming a trench by etching theepitaxial layer by using the hard mask pattern as an etch mask, andexposing a predetermined region of the semiconductor substrate;implanting a second conductivity type impurity into the bottom of thetrench by using the hard mask pattern as an ion implantation mask;forming an insulating layer in the trench; and removing the hard maskpattern.
 5. A method of fabricating a semiconductor device comprisingthe steps of: implanting a second conductivity type impurity into apredetermined region of a semiconductor substrate to form a diffusedbottom isolation layer; implanting a first conductivity type impurityinto the surface of the semiconductor substrate over the diffused bottomisolation layer to form a first conductivity type buried layer; forminga second conductivity type epitaxial layer covering the buried layer andthe semiconductor substrate; patterning the epitaxial layer to form atrench surrounding a predetermined region of the epitaxial layer, thetrench exposing a predetermined region of the semiconductor substrate;implanting the second conductivity type impurity into the lower side ofthe trench to form a diffused isolation wall connected to the diffusedbottom isolation layer to surround a predetermined region of thesemiconductor substrate; filing an insulating layer in the trench toform a trench isolation structure in contact with the diffused isolationwall; forming a field oxide layer to define a first active area and asecond active area on the upper side of the epitaxial layer surroundedby the trench isolation structure, wherein the first active area issurrounded by the field oxide layer, and the second active area isinterposed between the field oxide layer and the trench isolationstructure; forming a gate electrode and a source region on the firstactive area; and forming a drain region in the second active area,wherein the trench isolation structure, the diffused isolation wall andthe diffused bottom isolation layer define the device region comprisingthe semiconductor substrate and the epitaxial layer sequentiallydeposited.
 6. The method of claim 5, wherein the first conductivity typeimpurity is one selected from a group consisting of phosphorus (P),arsenic (As) and antimony (Sb).
 7. The method of claim 5, wherein thesecond conductivity type impurity is one selected from a groupcomprising boron (B), boronfluoric (BF₂) and indium (In).
 8. The methodof claim 5, wherein the gate electrode overlaps the field oxide layer.9. The method of claim 5, wherein the gate electrode is mesh-shapedstructure having a plurality of openings exposing a predetermined regionof the first active area.
 10. The method of claim 5, wherein the step offorming the source region comprises the steps of: implanting the secondconductivity type impurity into the first active area exposed at theopening to form a second conductivity type body region having anoverlapped region with the lower side of the gate electrode; implantinga first conductivity type impurity into the peripheral region of thefirst active area exposed at the opening to form a first conductivitytype diffused layer adjacent to the gate electrode; and implanting thesecond conductivity type impurity into the region surrounded by thefirst conductivity type diffused layer inside the opening to form asecond conductivity type diffused layer spaced apart from the gateelectrode.
 11. The method of claim 10, wherein the second conductivitytype diffused layer is more heavily doped than the body region.
 12. Themethod of claim 5, wherein the step of forming the drain regioncomprises the steps of: implanting a first conductivity type impurityinto the second active area to form a sink region vertically connectedto the buried layer; and implanting a first conductivity type impurityon the surface of the second active area to form a heavily dopeddiffused layer.
 13. The method of claim 12, wherein the heavily dopeddiffused layer is more heavily doped than the sink region.
 14. Themethod of claim 12, wherein the sink region is formed before forming thefield oxide layer.
 15. The method of claim 12, wherein the sink regionis formed after forming the field oxide layer.
 16. The method of claim12, wherein a thermal treatment process is performed for thesemiconductor substrate after forming the sink region to decrease theresistance of the sink region.
 17. The method of claim 5, wherein thestep of forming the trench, the diffused isolation wall and the trenchisolation structure comprises the steps of: forming a hard mask patternon the epitaxial layer; etching the epitaxial layer by using the hardmask pattern as an etch mask to form a trench exposing a predeterminedregion of the semiconductor substrate; implanting a second conductivitytype impurity into the bottom of the trench by using the hard maskpattern as an etch implantation mask; forming an insulating layer insidethe trench; and removing the hard mask pattern.